Method for monitoring online state of bonding wire of IGBT module
US11874341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Apr 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for monitoring an online state of a bonding wire of an Insulated Gate Bipolar Translator (IGBT) module comprises the following steps: Step 1, constructing a full bridge inverter circuit and an online measuring circuit and connecting two input ends of the online measuring circuit to a collecting electrode and an emitting electrode of an IGBT power module of the full bridge inverter circuit to realize a connection of the full bridge inverter circuit and the online measuring circuit; Step 2, establishing a three-dimensional data model of a healthy IGBT; Step 3, establishing a three-dimensional data model of the IGBT with a broken bonding wire; Step 4, optimizing a least squares support vector machine by adopting a genetic algorithm; and Step 5, estimating states of the three-dimensional data models obtained in the Step 2 and the Step 3 by utilizing the optimized least squares support vector machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.