Photonic chip and preparation method thereof
US11874497B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2019 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12164
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic chip and a preparation method thereof are provided. The chip includes a lithium niobate film modulator array, a first optical coupling array, and a silica waveguide wavelength-division multiplexer, and the lithium niobate film modulator array includes one or more lithium niobate film modulators and is used to modulate an optical signal; the first optical coupling array includes one or more first optical coupling structures, and the first optical coupling structure has one end connected to a corresponding lithium niobate thin film modulator and the other end connected to the silica waveguide wavelength-division multiplexer so as to transmit the modulated optical signal to the silica waveguide wavelength-division multiplexer; and the silica waveguide wavelength-division multiplexer is used to perform wavelength-division multiplexing on the modulated optical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.