Modular assembly for opto-electronic systems
US11874502B2 · kind B2 · utility
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3References
20Claims
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Key dates
| Filing date | Nov 21, 2022 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Nov 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.