Firmware component with self-descriptive dependency information
US11875147B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Aug 26, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/65
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.