Heat exchanger with integrated support structure
US11876203B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.