Patent · US Active

Sealing arrangement, plate assembly, electrochemical system, and method for producing a sealing arrangement

US11876255B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

REINZ-DICHTUNGS-GMBH · DE

Inventors

Stephan WENZEL · Weiler an der Zaber, DE
Wolfgang Berroth · Oberelchingen, DE
Bernd Gaugler · Ulm, DE
Kai-Uwe Lemke · Ulm, DE
André SPEIDEL · Orsenhausen, DE

Key dates

Filing date	May 10, 2021
Grant date	Jan 16, 2024
Priority date	—
Expiry date	Jun 30, 2041

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/50
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The present disclosure relates to a sealing arrangement, comprising: an elastomeric sealing element, which comprises a foamed material containing microspheres, and a metal layer having a surface structuring, the surface structuring comprising a plurality of depressions, wherein the sealing element is configured as a coating of the metal layer and is arranged at least in some areas on the surface structuring, wherein a concentration of the microspheres in the sealing element, measured perpendicular to the surface of the metal layer, is inhomogeneous. The disclosure additionally relates to a plate assembly, to an electrochemical system, and to a method for producing the sealing arrangement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.