High-frequency component

US11876277B2 · kind B2 · utility

Assignee

• Endress+Hauser SE+Co. KG · DE

Inventors

• Martin Hitzler · Dillingen/Saar, DE
• Winfried Mayer · Hobrechtsfelde, DE

Key dates

• Filing date: Jul 31, 2019
• Grant date: Jan 16, 2024
• Expiry date: Mar 19, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/107
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A high-frequency component for radar-based distance measurement comprises: a semiconductor component configured to generate electrical high-frequency signals; and coupling element configured as a substrate-integrated waveguide and electrically contacted by the semiconductor component as to couple the high-frequency signals as radar signals into a hollow waveguide of the high-frequency component, the hollow waveguide being in galvanic contact with the coupling element such that no defined distance between the hollow waveguide and the coupling element must be set to achieve an efficient coupling out of the high-frequency signal into the hollow waveguide. The galvanic contact thereby enables a simple manufacture of the high-frequency component and a compact and accurate distance measuring device using the high-frequency component.