Laser diode packaging platforms
US11876343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Mar 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/042
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.