Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices
US11877505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Feb 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.