Laser machining system

US11878368B2 · kind B2 · utility

Assignee

• 3D-Micromac AG · DE

Inventors

• Sven Albert · Kohren-Sahlis, DE
• Torsten Leichsenring · Wildenfels, DE
• Thomas Schmidt · Thierhaupten, DE
• Uwe Wagner · Volketswil, CH

Key dates

• Filing date: Sep 20, 2019
• Grant date: Jan 23, 2024
• Expiry date: Jul 25, 2040

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B27/123
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.