System and method for multi-material molding
US11878447B2 · kind B2 · utility
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3References
11Claims
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Key dates
| Filing date | Nov 22, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Feb 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multi-material molding apparatus and method includes a single mold having, within a mold cavity, one or more movable partitions that segregate at least first and second molding materials. The first molding material is processed to form a first molded portion of the multi-material part. The second molding material is then flowed, through the movable partition, into contact with the first molded portion. That second molding material is then solidified to form a second molded portion of the multi-material part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.