Patent · US Active

Leak protection bushing for hotrunner manifold assembly

US11878453B2 · kind B2 · utility

0Cited by

30References

16Claims

0Family size

Assignee

Incoe Corporation · US

Inventors

Scott Greb · Clinton Township, US
Anton Joerg · Großostheim, DE
Christian Striegel · Hainstadt, DE

Key dates

Filing date	Feb 11, 2022
Grant date	Jan 23, 2024
Priority date	—
Expiry date	Aug 1, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29K2101/12
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A hotrunner assembly for an injection molding apparatus includes a hotrunner manifold, a nozzle for conveying liquid resin from an outlet of the hotrunner manifold, a valve pin linearly movable within and along a longitudinal axis of the nozzle to control flow of the liquid resin from the outlet of the hotrunner manifold, an actuator for driving the valve pin, a primary seal disposed radially between the valve pin and walls of a bore extending through the hotrunner manifold, and a secondary seal located axially between the hotrunner manifold and the actuator and circumscribing a section of the valve pin to prevent gases or liquid resin from contacting the actuator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.