Temperature control apparatus and temperature control method
US11878477B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 19, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Oct 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7128
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A temperature control apparatus includes: a first pressure bonding unit which includes a first flow passage and a first pressure bonding surface which is to be brought into contact with an object; a temperature control fluid supply device which supplies a temperature control fluid in form of gas to the first flow passage in such a manner that the temperature control fluid is condensed on an inner wall surface of the first pressure bonding unit that partitions the first flow passage to adjust the first pressure bonding surface to a first heating temperature; and a pressure adjustment device which lowers an internal pressure of the first flow passage to promote vaporization of the temperature control fluid in form of liquid in the first flow passage in such a manner that the first pressure bonding surface is adjusted to a temperature lower than the first heating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.