Wafer holder band for mold injection process
US11878480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Nov 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure includes systems, devices, and methods for preventing contamination during formation of an optical article. In some implementations, a device for preventing contamination of a mold cavity during injection molding of a function wafer includes a containment band having an annular base that defines a first opening configured to receive a functional wafer. The device also includes one or more sidewalls that project a first direction from and surround at least a portion of the first opening. The one or more sidewalls may be configured such that, during formation of an optical article, a first portion of the functional wafer is in contact with the one or more sidewalls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.