Hot stamped component
US11878488B2 · kind B2 · utility
0Cited by
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3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Mar 23, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12972
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot stamped component, includes: a base material; and a Zn-based plating layer provided in contact with the base material as an upper layer of the base material and containing Zn and Ni. A region of the Zn-based plating layer on a base material side is a Fe—Zn solid solution containing Ni, and two or more twins exist in 10 crystal grains of the Fe—Zn solid solution containing Ni adjacent to an interface between the base material and the Zn-based plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.