Low-viscosity thermosetting starch adhesive for particleboards, and preparation method therefore
US11879071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2023 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/50
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance. The properties of the manufactured particleboards reach the standard of P2 type particleboards, so that the adhesive can be suitable for mass production and can be widely applied in the preparation of wood decoration, particleboards, plywood and fiberboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.