Curable precursor of a structural adhesive composition

US11879078B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Adrian T. Jung · Kaarst, DE
• Boris Tasch · Düsseldorf, DE
• Dirk Hasenberg · Raeren, BE
• Olaf Ludewig · Düsseldorf, DE
• Elisabeth Cura · Düsseldorf, DE

Key dates

• Filing date: Oct 3, 2019
• Grant date: Jan 23, 2024
• Expiry date: Apr 3, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J171/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.