Release liner for repositionable adhesive articles

US11879081B2 · kind B2 · utility

Assignee

• MONDI AG · AT

Inventors

• Helmut Schönfelder · Thansau, DE
• Rolf Krekel · Raubling, DE
• Wilhelm Munninger · Rosenheim, DE

Key dates

• Filing date: Dec 17, 2020
• Grant date: Jan 23, 2024
• Expiry date: Jul 24, 2041

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2483/005
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention inter alia relates to a release liner, which comprises according to an embodiment, a carrier substrate, a thermoplastic polymer layer applied on one side of the carrier substrate, and a release layer applied on the thermoplastic polymer layer on the side opposite to the carrier substrate. The thermoplastic polymer layer and the release layer include a network of ridges resulting in elevations of the surface of the release liner. The surface on the release layer side has a roughness at least between the ridges, such that it has a plurality of pits. The average number of pits per an area of 3.4 mm2 of the plan view of the release liner surface is at least 50. The pits extend at least to a level of 10.0 μm above the deepest point of the deepest pit within said area.