Tin alloy plating solution
US11879182B2 · kind B2 · utility
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2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Nov 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.