Abrasive sampling system and method for representative, homogeneous, and planarized preparation of solid samples for laser ablation
US11879850B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Apr 14, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/06113
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are described for providing a representative, homogeneous, and planarized target for solid sample laser ablation. A method embodiment includes, but is not limited to, removing portions of a solid sample with an abrasive sampling system, the abrasive sampling system including at least one of a plurality of abrasive particles configured to hold the portions of the solid sample on an abrasive substrate between the abrasive particles or a texturized surface configured to hold the portions of the solid sample on the texturized surface; transferring the abrasive sampling system holding the portions of the solid sample to a laser ablation system; and ablating the portions of the solid sample held by the abrasive sampling system with the laser ablation system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.