Ultrasound testing of adhesive bonds
US11879867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2022 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Jul 14, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There are described a system and method for performing ultrasound testing of a component comprising a first material layer and a second material layer bonded by an adhesive layer. The method comprises applying input ultrasound to the component to cause longitudinal propagation of ultrasonic guided waves through the first material layer and the adhesive layer; acquiring acoustic waves from the component, wherein the acoustic waves produced by the longitudinal propagation of the ultrasonic guided waves; generating a signal representation of the acoustic waves; comparing the signal representation of the acoustic waves to a plurality of reference signals to identify a characteristic of the adhesive layer; and outputting an output signal indicative of the characteristic of the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.