Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds
US11881440B2 · kind B2 · utility
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Key dates
| Filing date | Feb 21, 2020 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.