Electronic device, semiconductor device, packaging structure, bracket and method of manufacturing the bracket

US11881548B2 · kind B2 · utility

Assignee

• SONGSHAN LAKE MATERIALS LABORATORY · CN

Inventors

• Weiyun Wang · Lo Wu, CN
• Xinqiang WANG · Beijing, CN
• Yongde Li · Nanjing, CN
• Houjin Wang · Longbeilingcun, CN
• Junjie Kang · Beijing, CN
• Ye Yuan · Shanghai, CN
• Wei Luo · Nanhu, CN

Key dates

• Filing date: Nov 24, 2020
• Grant date: Jan 23, 2024
• Expiry date: Jan 2, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.