Heat dissipation sheet and electronic device including same
US11881612B2 · kind B2 · utility
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15Claims
0Family size
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Key dates
| Filing date | Aug 13, 2021 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Apr 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.