Vented liquid-resistant microphone assembly
US11882394B2 · kind B2 · utility
0Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2022 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Feb 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.