Heat spreader having conduction enhancement with EMI shielding
US11882673B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2020 |
| Grant date | Jan 23, 2024 |
| Priority date | — |
| Expiry date | Dec 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat spreader including a body having a first conduction value and a first electromagnetic interference shield value. The heat spreader further includes a conduction enhancement affixed to the body, the conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value. At least a portion of the conduction enhancement is positioned relative to the body for increasing an effective electromagnetic interference shield value of the body associated with the at least a portion of the conduction enhancement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.