Sensor module, method for manufacturing sensor module, and blood pressure measurement device
US11883137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Oct 19, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Provided is a sensor module, a method for manufacturing a sensor module, and a blood pressure measurement device with a highly smooth surface and high sensor accuracy. A sensor module 63 includes: a pressure sensor portion 71; a sensor base 72 including a support wall portion 72a with flow holes 72d to 72g formed extending through the support wall portion 72a from one main surface side to the other main surface side, the pressure sensor portion 71 being disposed on the one main surface side of the sensor base 72; a sensor head cover 73 including an opening 73a at a position opposite a sensor 71a and disposed on the one main surface side of the support wall portion 72a of the sensor base 72 with a gap 79 that communicates with the flow holes 72d to 72g and the opening 73a formed therebetween; and a soft portion 74 disposed in the opening 73a that covers the pressure sensor portion 71.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.