Method and appliance for cutting materials by multi-beam femtosecond laser
US11883903B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 25, 2017 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method for cutting dielectric or semiconducting material with a laser. The method includes the following steps: emission of a laser beam including at least one burst of N femtoseconds laser pulses; spatial separation of the laser beam into a first split beam having a first energy, and respectively, a second split beam having a second energy; spatial concentration of energy of the first split beam in a first zone of the material, respectively, of the second split beam in a second zone of the material, the first zone and the second zone being separate and staggered by a distance dx; and adjustment of the distance between the first zone and the second zone in such a way as to initiate a straight micro-fracture oriented between the first zone and the second zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.