Dual-wavelength laser systems and material processing utilizing such systems
US11883904B2 · kind B2 · utility
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23Claims
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Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Dec 18, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.