Void fill packaging
US11884470B2 · kind B2 · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2021 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Oct 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7138
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A void-fill package, and method of making the same, comprising at least 50%, on a weight basis of the package, recycled polyethylene; at least 40%, on a weight basis of the package, virgin polyethylene; at least one moisture scavenger; and at least one melt stabilizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.