Device, package structure and manufacturing method of device
US11884535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Jun 17, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/05
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.