Cleaning compositions and methods of use thereof
US11884900B2 · kind B2 · utility
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18Claims
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Assignee
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Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Apr 14, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.