Door lock assembly including weatherization
US11885161B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | May 4, 2042 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE05B2047/0058
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An electronic door lock system includes a gasket system for protecting electrical and mechanical components from exterior water and air. A lock portion may include a gasket, a circuit board, and a plate disposed between a first and second housing. The gasket includes an L-shaped perimeter that wraps around a first side and perimeter edge of the circuit board. The plate compresses the gasket perimeter against a ridge on the first housing to form a seal around the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.