Probe tip assembly for testing optical components
US11885830B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06761
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.