Resin, positive photosensitive resin composition and use
US11886115B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2023 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Apr 22, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/039
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition comprises a resin, a diazonaphthoquinone compound and a solvent. The resin comprises a combination of any one or more of polyamic acid, polyamic ester and polyimide of a segment shown in the following structure; . The resin film formed by the positive photosensitive resin composition is applied to a semiconductor passivation film, a semiconductor element protective film, an insulating layer of an organic electroluminescent element, a flat film of a thin film transistor (TFT) substrate, a wiring protective insulating film of a circuit board and a flat film for displays and solid camera elements. The photosensitive resin film formed by the positive photosensitive resin composition has the characteristics of low shrinking rate and excellent heat resistance and resolving power, and has good application effect in electronic elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.