Laser diode, thermally assisted magnetic head, head gimbal assembly, hard disk drive and method of manufacturing a head gimbal assembly
US11887638B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Nov 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.