Key module
US11887791B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 16, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Feb 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2239/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A key module includes a bottom plate, a circuit layer, a key cap, a supporting structure, a touch member, and a flexible circuit board. The bottom plate has a first surface and a second surface opposite to each other. The circuit layer is disposed on the first surface and has a first opening. The key cap is disposed above the circuit layer and covers the first opening. The supporting structure is disposed between the bottom plate and the key cap. The touch member is disposed at the key cap. The flexible circuit board is electrically connected to the touch member and passes through the first opening to extend next to the second surface of the bottom plate. When the key cap moves downward relative to the bottom plate, a portion of the flexible circuit board located between the key cap and the bottom plate is bent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.