Electronic power module
US11887910B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Sep 2, 2019 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Feb 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic power module includes at least a semiconductor chip having at least one electronic power component and two metal layers between which the semiconductor chip is directly secured. At least a first of the two metal layers forms a redistribution layer having several distinct metal portions, each electrically connected to at least one electrical contact pad of the semiconductor chip, and/or at least one second of the two metal layers includes at least one first structured face arranged against the semiconductor chip and having at least one pad formed in a part of its thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.