Patent · US Active

Microelectronic structures including bridges

US11887962B2 · kind B2 · utility

0Cited by

14References

7Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Omkar G. Karhade · Chandler, US
Nitin A. Deshpande · Chandler, US
Mohit Bhatia · Chandler, US
Sairam Agraharam · Chandler, US
Edvin Cetegen · Chandler, US
Anurag Tripathi · Gilbert, US
Malavarayan Sankarasubramanian · Chandler, US
Jan Krajniak · Mesa, US
Manish Dubey · Chandler, US
Jinhe Liu · Chandler, US
Wei Li · Shanghai, CN
Jingyi Huang · Chandler, US

Key dates

Filing date	Jun 16, 2020
Grant date	Jan 30, 2024
Priority date	—
Expiry date	Dec 26, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15156
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.