Method of operating microelectronic package
US11887974B2 · kind B2 · utility
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8References
9Claims
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Key dates
| Filing date | Feb 2, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of operating a microelectronic package includes a processing device stacking vertically with at least one memory device. The method includes a step of: reading data stored in a plurality of memory cells of a plurality of memory units of the memory device, with the processing device, with a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.