Optimization of high resolution digitally encoded laser scanners for fine feature marking
US11888084B2 · kind B2 · utility
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38References
19Claims
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Key dates
| Filing date | Aug 5, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.