Bottom-emitting emitter array with a bottom side metal layer
US11888293B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Jan 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/04256
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In some implementations, an emitter array may include a substrate, an epitaxial structure on the substrate, a plurality of bottom-emitting emitters defined in the epitaxial structure, a first electrical contact positioned at a top side of the epitaxial structure, a second electrical contact positioned at the top side of the epitaxial structure, and a metal layer disposed on a bottom side of the substrate. The metal layer may be electrically connected to the second electrical contact. The metal layer may include one or more openings for light emission of the plurality of bottom-emitting emitters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.