Patent · US Active

Power module having at least two power semiconductor arrangements that are contacted on a substrate

US11888407B2 · kind B2 · utility

0Cited by

0References

17Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

ROBERT GOSPOS · Buckenhof, DE
Lutz Namyslo · Eschborn, DE
Bernd Kürten · Großenseebach, DE
FELIX ZEYSS · Erlangen, DE
Michael Endres · Scheßlitz, DE
Silvio Höhne · Hersbruck, DE
Pietro Botazzoli · Uttenreuth, DE

Key dates

Filing date	Aug 18, 2021
Grant date	Jan 30, 2024
Priority date	—
Expiry date	Jan 15, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.