Annealing system and annealing method integrated with laser and microwave
US11889609B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 12, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.