Techniques for high-speed signal layer transition
US11889617B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes first and second surfaces, first and second layers, and first and second vias. The first via extends from a first layer to the second surface and includes a first portion that is on a conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the first via is greater than that of the second portion of the first via. The second via extends from the second surface to the second layer. The second via includes a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the second via is greater than that of the second portion of the second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.