Integrated circuit thermal management system
US11889661B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 17, 2020 |
| Grant date | Jan 30, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/008
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An integrated circuit thermal management system includes an enclosure, a heat exchanger, an integrated circuit, a slide having a moveable slide body, an electromagnetic coil, a magneto caloric material and controller circuitry. The heat exchanger is positioned on a first side of the enclosure, and the integrated circuit is positioned on a second side of the enclosure with a temperature sensor configured to generate a temperature signal indicative of a temperature of the integrated circuit. The slide is disposed in the enclosure extending between the heat exchanger and the integrated circuit. The electromagnetic coil and the magnetocaloric material are included on the slide body. The controller is configured to control energization of the magnetic coil and movement of the magnetocaloric material on the slide body between the heat exchanger and the integrated circuit based on the temperature signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.