In-situ digital image correlation and thermal monitoring in directed energy deposition
US11890808B2 · kind B2 · utility
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Key dates
| Filing date | Dec 17, 2020 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Aug 15, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and a system for digital image correlation and thermal monitoring during directed energy deposition are provided. The method and the system include global off-axis 3D mapping of surfaces features at high frame rates using the natural surface roughness of the additive build. Infrared thermography is projected onto these surface features to record the thermo-mechanical history of the finished component. As set forth herein, the method and the system provide a low-cost solution to monitoring and optimizing the unique temporal artifacts induced by complex scan strategies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.