Polyimide film for display substrate
US11891483B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jul 20, 2018 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyimide film showing a low stress change rate on a silicon wafer. The present invention can minimize cracks which are formed due to the stress change of polyimide, in a process for depositing an inorganic film on a polyimide substrate at a high temperature, and thus can reduce electrical property degradation such as a recoverable residual image and decrease in current of a flexible display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.