Thermosetting epoxy resin composition having low curing temperature and good storage stability
US11891507B2 · kind B2 · utility
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Key dates
| Filing date | Dec 23, 2019 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.