Current sensor package
US11892476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2022 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Feb 15, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R19/0092
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Current sensor packages are described including a leadframe configured to carry a current to be sensed and a current sensor that is electrically isolated from the leadframe. The current sensor is disposed adjacent to a first portion of the leadframe that includes a plurality of notches. An encapsulating material is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches. The current sensor includes a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate. The first magnetic field sensing element and the second magnetic field sensing element are disposed on opposite sides of a central axis of the first portion of the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.